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a shaft made of aluminum is 400 mm in diameter at room temperature 21degc its coefficient of thermal expansion 248
a steel collar is to be heated from room temperature 70degf to 700degf its inside diameter 1000 in and its outside
a bearing for the output shaft of a 200 hp motor is to be heated to expand it enough to press on the shaft at 70degf
a steel collar whose outside diameter 3000 in at room temperature is to be shrink fitted onto a steel shaft by heating
a pin is to be inserted into a collar using an expansion fit properties of the pin and collar metal are coefficient of
1 what is rapid prototyping provide a definition of the term2 what are the three types of starting materials in rapid
a 5-mm-diameter bolt is to be tightened to produce a preload 250 n if the torque coefficient 023 determine the torque
1 how does mechanical assembly differ from the other methods of assembly discussed in previous chapters eg welding
the processable area on a 156-mm-diameter wafer is a 150-mm-diameter circle how many square ic chips can be processed
1 what is an integrated circuit2 name some of the important semiconductor materials3 describe the planar process4 what
a single crystal boule of silicon is grown by the czochralski process to an average diameter of 320 mm with length
the part in problem 331 is to be fabricated using fused deposition modeling instead of stereolithography layer
a silicon boule has been processed through grinding to provide a cylinder whose diameter 285 mm and whose length 900
the surface of a silicon wafer is thermally oxidized resulting in a sio2 film that is 100 nm thick if the starting
it is desired to etch out a region of a silicon dioxide film on the surface of a silicon wafer the sio2 film is 100 nm
on a particular production line in a wafer fabrication facility the crystal yield is 60 the crystal-toslice yield is 60
suppose it is desired to produce a memory device that will be contained in a dual-in-line package with 32 io leads how
the first ibm personal computer was based on the intel 8088 cpu which was released in 1979 the 8088 had 29000
in the equation for rents rule with c 45 and m 05 determine the value of nio and nc at which the number of logic
it is desired to determine the effect of package style on the number of circuits logic gates that can be fabricated
an integrated circuit used in a microprocessor will contain 1000 logic gates use rents rule with c 38 and m 06 to
a 250 mm diameter silicon wafer has a processable area that is circular with a diameter 225 mm the ic chips that will
given that crystal yield 55 crystal-to-slice yield 60 wafer yield 75 multiprobe yield 65 and final test yield 95
a silicon wafer with a diameter of 200 mm is processed over a circular area whose diameter 190 mm the chips to be
a silicon wafer has a processable area of 350 in2 the yield of good chips on this wafer is ym 75 if the defects are