Discuss the below:
Q: A scheme for dissipating heat from an array of N = 100 integrated circuits involves joining the circuits to the bottom of a plate and exposing the top of the plate to a water bath. The water container is of length L = 100 Hun on a side and is exposed to airflow at its top surface. The flow is turbulated by the protruding lip of the side wall.
If the sides and bottom of the container are well insulated from the surroundings and heat is uniformly dissipated in each circuit, at what rate may heat be dissipated from each circuit when the water temperature is maintained at Tb = 350 K?
