Problem
1 (a). What is the non-bonded area caused by a 0.3 µm particle on 150 mm wafers?
(b). If 150 mm wafers are specified to have 50 particles of 0.3µm size, what fraction of the wafer area will be non-bonded?
2. What is the critical particle radius for 100 mm silicon wafers?
3. What is resolution of a 160 MHz acoustic measurement of voids?
The response should include a reference list. Double-space, using Times New Roman 12 pnt font, one-inch margins, and APA style of writing and citations.