1. How deep into aluminium sputtering target will 500 eV argon ions penetrate?
2. Pulsed (Bosch) process DRIE chamber volume is 50 L, flow rate is 200 sccm and operating pressure is 20 mtorr. What is the shortest possible pulsing period?
3. If 5-kW power is applied to aluminium sputtering target of 200 mm diameter, what is the maximum possible deposition rate?
4. XPS measurement takes 15 min. What is the pressure in a XPS chamber?