Pull-strength tests on 10 soldered leads for a semi conductor device yield the following results in pounds force required to rupture the bond:
19.9 12.7 13.2 16.9 10.6
18.8 11.1 14.3 17.0 12.5
Another set of 8 leads was tested after encapsulation to determine whether the pull strength has been increased by encapsulation of the device, with the following results
24.9 22.8 23.6 22.1 20.4 21.6 21.8 22.5
Do the testing results support the claim that encapsulation improves the pull strength by 10 pounds?