On a particular production line in a wafer fabrication facility, the crystal yield is 60%, the crystal-toslice yield is 60%, wafer yield is 90%, multiprobe is 70%, and final test yield is 80%.
(a) What is the overall yield for the production line?
(b) If wafer yield and multiprobe yield are combined into the same reporting category, what overall yield for the two operations would be expected?