If the substrate is bonded to a metallic heat sink estimate, Electrical Engineering

If the substrate is bonded to a metallic heat sink estimate

Briefly trace how the demands of electronic circuit technology have impacted on the development of ceramic ‘packaging' technology. An alumina substrate of dimensions 1 cm 1 cm 0.5 mm carries a device dissipating 20W. If the substrate is bonded to a metallic heat sink, estimate the steady state difference in temperatures between the surface carrying the device and the heat sink. The thermal conductivity of alumina may be taken to be

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Electrical Engineering: If the substrate is bonded to a metallic heat sink estimate

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Electrical Engineering: If the substrate is bonded to a metallic heat sink estimate

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