A vertical array of circuit boards is immersed in quiescent ambient air at T∞ = 17°C. Although the components protrude from their substrates, it is reasonable, as a first approximation, to assume fla plates with uniform surface heat flux q"s. Consider boards of length and width L = W = 0.4 m and spacing S = 25 mm. If the maximum allowable board temperature is 77°C, what is the maximum allowable power dissipation per board?
