Federal semiconductors issued 13 bonds dated january 1 with


Federal Semiconductors issued 13% bonds, dated January 1, with a face amount of $690 million on January 1, 2016. The bonds sold for $644,005,394 and mature on December 31, 2035 (20 years). For bonds of similar risk and maturity the market yield was 14%. Interest is paid semiannually on June 30 and December 31.

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Financial Accounting: Federal semiconductors issued 13 bonds dated january 1 with
Reference No:- TGS01589584

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