Determine the total thermal processing time


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Q: In thermo mechanical data storage, a processing head, consisting of M heated cantilevers, is used to write data onto an underlying polymer storage medium. Electrical resistance heaters are micro fabricated onto each cantilever, which continually travel over the surface of the medium. The resistance heaters are turned on and off by controlling electrical current to each cantilever. As a cantilever goes through a complete heating and cooling cycle, the underlying polymer is softened, and one bit of data is written in the form of a surface pit in the polymer. A track of individual data bits (pits), each separated by approximately 50 nm, can be fabricated. Multiple tracks of bits, also separated by approximately 50 nm, are subsequently fabricated into the surface of the storage medium. Consider a single cantilever that is fabricated primarily of silicon with a mass of 50 x 10-18 kg and a surface area of 600 X 10-15 m2. The cantilever is initially at Tj = T? = 300 K, and the heat transfer coefficient between the cantilever and the ambient is 200 X 103 W/m2 · K.

(a) Determine the Ohmic heating required to raise the cantilever temperature to T = 1000 K within a heating time of t h = 1µs.

(b) Find the time required to cool the cantilever from 1000 K to 400 K (tc) and the thermal processing time required for one complete heating and cooling cycle, tp = th + tc .

(c) Determine how many bits (N) can be written onto a 1 mm x 1 mm polymer storage medium. If M = 100 cantilevers are ganged onto a single processing head, determine the total thermal processing time needed to write the data

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Electrical Engineering: Determine the total thermal processing time
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