Question: Determine the temperature distribution inside the aluminum heat sink in Example if the surrounding air is at 25°C, with a corresponding heat transfer coefficient h = 20 W/m2 • K. The heat sink sits on a chip that dissipates approximately 200 W. Extrude the frontal area shown in the accompanying figure 20.5 mm to create a quarter model of the heat sink.
Example: Aluminum heat sinks arc commonly used to dissipate heat from electronic devices. Consider an example of a heat sink used to cool a personal-computer microprocessor chip The front view of the heat sink is shown in Figure 10.23. Using ANSYS. generate the solid model of the heat sink. Because of the symmetry model only a quarter of the heat sink by extruding the shown frontal area by 20.5 mm.