1. Draw a layout, in top view and perspective, where the mask would be opaque to realize an "+" shaped metal line using a positive resist and the lift-off technique.
2. Do the same as Problem 1, but using a negative resist.
3. Design a photolithography and metallization sequence of steps to obtain a Au square and a Ti circle on the surface of a semicond uctor wafer. Draw the shape of the mask to be used. At each appropriate step, indicate whether you use the direct patterning or the lift-off technique, you use positive or negative resist.