Semiconductor manufacturing processes have long and complex assembly flows, so matrix marks and automated 2d-matrix readers are used at several process steps throughout factories. Unreadable matrix marks negatively affect factory run rates because manual entry of part data is required before manufacturing can resume. A 24 factorial experiment was conducted to develop a 2d-matrix laser mark on a metal cover that protects a substrate-mounted die. The design factors are A = laser power (9 and 13 W), B = laser pulse frequency (4000 and 12,000 Hz), C = matrix cell size (0.07 and 0.12 in.), and D = writing speed (10 and 20 in./sec), and the response variable is the unused error correction (UEC). This is a measure of the unused portion of the redundant information embedded in the 2d-matrix. A UEC of 0 represents the lowest reading that still results in a decodable matrix, while a value of 1 is the highest reading. A DMX Verifier was used to measure UEC. The data from this experiment are shown in Table P6.5.
Table P6.5
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(a) Analyze the data from this experiment. Which factors significantly affect UEC?
(b) Analyze the residuals from this experiment. Are there any indications of model inadequacy?