The accompanying data on x = current density and y = rate of deposition appeared in the article "Plating of 60/40 Tin/Lead solder for Head Termination Metallurgy". Do you agree with the claim by the article's author that "a linear relationship was obtained from the tin-lead rate of deposition as a function of current density"? Explain your reasoning.
x: 20 40 60 80
y:.24 1.20 1.71 2.22