Question: A silicon chip is cooled by passing water through micro channels etched in the back of the chip, as shown in Fig. The channels are covered with a silicon cap. Consider a 10-mm × 10-mm-square chip in which N = 50 rectangular micro channels, each of width W = 50 µm and height H = 200 µm have been etched. Water enters the micro channels at a temperature Ti = 290 K, and a total flow rate of 0.005 kg/s. The chip and cap are maintained at a uniform temperature of 350 K. Assuming that the flow in the channels is fully developed, all the heat generated by the circuits on the top surface of the chip is transferred to the water, and using circular tube correlations, determine:
(a) The water outlet temperature, Te
(b) The chip power dissipation, We Evaluate liquid water properties at a bulk mean temperature of 298 K. Is this a good assumption?
