A 20 - mu m - thick p membrane fig 224 is desired for a


A 20 - μ m - thick p++ membrane (Fig. 2.24) is desired for a micro device. Using a 500 - mm - thick (100) silicon wafer and KOH as an etchant, determine the etching time to finish the wet etching.

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Econometrics: A 20 - mu m - thick p membrane fig 224 is desired for a
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